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July 17, 2020 | Local, Clean technologies, Big data and Artifical Intelligence, Advanced manufacturing 4.0, Autonomous systems (Drones / E-VTOL), Virtual design and testing, Additive manufacturing

We are looking for suppliers with the capacities required for presentation to a prime contractor!

We are looking for suppliers with the capacities required for presentation to a prime contractor!

We are looking for technology suppliers who could meet the needs presented below.

The selected companies will then be put in contact with the client to present their technology during a webinar.

Tactical Systems

  • Innovative ID Technology

    • Small SWAP cooperative ID Systems

    • Use of Quatum Technologies for secure comms/ID

  • Processing

    • Independent multi-core processing

    • Dal B capability

  • Additional Opportunities:

    • Small efficient GaN transmitters

    • Crypto capability-IP/FPGA-based

    • CSAC Time Standards-Printed Flex Circuits

    • Any technology that could provide SWAP enhancements

Mission Computer Product needs and Collaboration Opportunities

  • Innovative Thermal packaging Solutions

  • Additional Opportunities
    • Rugged OpenVPX capability
    • Fast prototyping-switches and processors
    • Cybersecurity and multi-level security

Optical ISR Product Needs and Collaboration Opportunities

  • Image Processing
  • Hyperspectral sensors and processing
    • Focus on low cost low SWAP expendable
  • Additional Opportunities for innovative technologies supporting
    • WAMI Enhancement-sensitivity, SWAP, Affordability
    • Focal planes
    • Optical components
    • Beam steering

Antenna Product Needs and Collaboration Opportunities

  • Meta-Material Capabilities
    • Reduced profile
    • Wider Bandwidth
    • Increased Radiated power
    • FSS-based metamaterials for cavity resonators
    • RF absorption
    • Patch antennas with better directivity
  • STAP Algorithms
    • Support for controlled radiation pattern antenna products
  • Materials for extreme environment
    • Ultra high temp RF materials
    • Ultra high temp adhesive
    • Thermal protective radome material
    • High tempRF connectors

Space Systems Challenge problems

  • Modelling and models for single event effects on semiconductor components
    • space packaging for thermal management, use of non-hermetic packaging in space

    • Rad-tolerant FPGA software-defined radio technology beyond 2012-generation devices

    • small size laser bean director for 100 urad class open loop repeatability

    • low cost precision optical assembly methods for small quantity complex designs suitable for field environmental conditions

Communications and Navigation Solutions Technical Challenges

  • Communications in congested spectrum
    • Dynamic spectrum access, interference mitigation (signal processing and nulling)
  • Efficient Use of Processing Resources
    • Dynamic Partial FPGA Reconfiguration, efficient auto code generation
  • Navigation
    • Assured position navigation and timing techniques
  • Networking Technologies
    • Directional networking, mesh networking, network management of Link 16 systems
  • Open architecture systems
    • 3U VPX open architecture hardware, software, and waveforms
  • Other Technologies
    • Link 16 for LEOs, free space optical communications, multi-band power amplifiers for VHF, UHF and L-band Communications, multi-function phased arrays and phased array enabling technologies

If you think you have the requested capabilities, send your information to:

Pauline Breyton

pauline.breyton@aeromontreal.ca

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